Article by: EE Times Asia
TI’s efforts in the high voltage and automotive markets in Taiwan and Southeast Asia have been recognized by the region’s engineering community as the company won five product award categories at EE Asia Awards 2022.
Trends in sustainability and energy-efficient design are driving countries and industries around the world to adopt strategies to save energy and reduce carbon emissions.
From a mobility perspective, attention has shifted to electric vehicles (EVs), which are seen as playing an important role in reducing carbon emissions.
The development of 5G, artificial intelligence (AI), machine learning and industrial plant automation, on the other hand, are driving the demand for increased computing. More and more large-scale data centers are being built to improve computing power, which in turn increases the demand for electricity.
Amid these developments, power-related components must also deliver increased performance in ever-smaller packages to help systems achieve power efficiency. To enable this, higher power densities are required. With this in mind, more and more semiconductor manufacturers have focused on wide bandgap components, such as gallium nitride (GaN), not only to meet the various needs of high-voltage systems, but also to achieve unprecedented power density requirements.
Leading this development is Texas Instruments (TI), which has been investing in GaN research and development for over a decade now. Additionally, TI has developed devices for safety compliance systems and advanced driver assistance system (ADAS) solutions. To strengthen its presence in high-voltage and automotive applications in Asia, TI has continuously improved its power device technology and optimized product features in these application areas.
TI’s efforts in the high voltage and automotive markets in Taiwan and Southeast Asia have been recognized by the region’s engineering community as the company won in five product award categories this year EE Awards Asia.
Now in its second year, EE Awards Asia celebrates the innovation, creativity and contributions of the Asian engineering community that have made a difference in the way we work, live and communicate over the past year. Organized by AspenCore, the publisher of EE Times Asia, EE Times Taiwan, EE Times India, EDN Asiaand EDN Taiwan, This year EE Awards Asia attracted more than 400 entries from 137 companies around the world, competing for 22 awards.
TI won five awards: Best MCU/Driver IC for its Sitara AM243x MCUs in Taiwan; Best IP/Processor of the Year for its Jacinto 7 processor platform in Asia; and Best RF and Wireless IC of the Year for its CC2662R-Q1 Wireless MCU, for the Taiwan and Asia categories. Additionally, TI won a corporate award as a featured vehicle electronics solution provider.
The CC2662R-Q1 is a wireless battery management system that supports wireless software communication protocols, has strong anti-interference ability and high interoperability, and complies with ASIL D functional safety specifications, which allows designers to easily achieve system-level design. and security.
Meanwhile, as the engineering community embraces Industry 4.0, high-tech equipment is becoming increasingly smarter, enabling functions such as real-time industrial communications, functional safety, predictive maintenance and logging. cloud in control systems. These features are supported by TI’s Sitara AM243x microcontrollers, which are designed for the processing requirements of Industry 4.0 applications. Incorporating heterogeneous processors (MCY+MPU), Sitara microcontrollers can dramatically improve performance and support multiple communication protocols in Industry 4.0 applications, reducing costs and accelerating circuit development .
Finally, TI’s new Jacinto 7 processor series features on-chip functional safety features that allow design engineers to easily achieve safety certification and end-product goals. The Jacinto 7 processor has various security features that help reduce system BOM and reduce performance load on each core. Additionally, the SDK software can provide safety-related drivers and diagnostic databases, which will help design engineers reduce technical development efforts by simplifying safety architecture and software functions.
Helping the industry achieve sustainable goals
Energy-efficient innovation continues to be the long-term goal of manufacturers in Asia and the industry as a whole. And in increasingly high-voltage applications, reliable, high-power-density power solutions must remain the focus.
Going forward, TI will continue to develop more highly integrated GaN solutions and components that meet the power needs of consumer electronics, industrial, and data center server applications, to provide engineers and designers with more choices. that will help these industries move towards their energy. savings and emission reduction targets.